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This is an in-depth analysis article on PCB assembly and soldering. Here we will introduce in detail what is soldering, the definition of soldering, and the type of soldering, etc. Soldering in an intricate craft that`s appreciated by geeks who know how much patience and precision it needs to produce a good-looking solder connection. Soldering is essential in most electronic devices, even with the development of microchips. No wonder people are still interested to know about it! What is soldering? Soldering is the process of joining two or more different types of metals together by melting solder. The solder or filler metal is an alloy melted using a hot iron at a temperature higher than 600 degrees Fahrenheit. Soldering is mainly used in making PCBs, plumbing, and roofing. Today, we`ll be learning all about soldering. What is it? What are its applications? How does the process go? All that will be covered in this in-depth soldering guide. Table of Contents What Is Soldering? The Backstory – Who Invented Soldering? How Does Soldering Work? 3 Main Types of Soldering Soldering by Core Types Which Flux Can Be Used for Soldering? What Is a Soldering Gun Used For? What Metals Are Used in Soldering? What Is Leaded Solder? – Advantages and Disadvantages What Is the Difference Between Silver Solder and Regular Solder? What Is the Strongest Solder? Soldering Safety – Tips and Tricks Conclusion What Is Soldering? At its simplest form, soldering is the process of joining two metal pieces with a third type of metal, whose melting point is lower than theirs. This bonding metal is called [solder." Think of an electric circuit, that classic look of a connective tissue on the PCB that links the circuit components together. This [connective tissue" you see is solder. Soldering is an indispensable part of the electronics industry, where it`s the primary way to join electrical components together. It`s equally essential in making jewelry, joining pipes, air conditioning, stained glass work, sheet metal work, and the list goes on. One essential distinction to be made here is that soldering is different from welding and brazing. While all three processes have the same goal, joining metal pieces together, they do it differently. According to the American Welding Society, soldering is joining metal pieces together at a temperature below 840 Fahrenheit degrees. On the other hand, brazing and welding use higher temperatures and produce stronger bonds. The main pitfall of soldering, though, is the difficulty of correcting its flaws. It`s like ink on paper; what`s done is done, and there is no way to fix it. That`s why it requires loads of practice to master soldering. The Backstory – Who Invented Soldering? The art of gluing metals together can be traced back to our ancestors. It`s been used by goldsmiths in Egypt and Troy. Four thousand years ago, they discovered tin, which developed later into the solder alloy. Back then, they used a metal piece heated by fire flames or burning coal to solder. In 1896, Richard Schneider and August Tinnerhol of the American Heater Company developed the first soldering iron, and they received a patent for the [First Electric Heating Apparatus." Later on, some improvements were introduced to the tool. General Electric produced a new soldering iron with a latch held to it. They also added a rack that`s connected to a radiator to dissipate the heat of the iron. It was Ernst Sachs who took the step to manufacture a soldering iron, especially for the industry. The German engineer patented his hammer iron in 1921. He then founded Ersa, his own company that takes its name from his initials to mass-produce and distribute industry soldering irons all over the globe. The first use of soldering in electronics was courtesy of William Alferink in 1926 when he introduced the first soldering station. He was granted a patent for a [Combined Holder and Automatic Circuit Breaker for Electric Soldering Irons" two years later. The soldering iron started to take the shape of a gun. It was initiated by the Supreme Instruments company in Mississippi, where they invented a soldering pistol for radio repairs. This was in the late thirties. Then, a generic soldering gun came to life in 1946. Thanks to Carl Weller of Pennsylvania, who received a patent for the [First Solder Gun." He went on to found his own manufacturing company. This is considered to be the first instant heat soldering iron. Until then, people had to heat the iron using fire or wait for electricity to heat it. American Beauty jumped back to the game in 1949. They developed [Temperature Regulating Stands" to control the temperature of their soldering irons in an attempt to keep up with Weller`s innovative instant irons. In 1960, Weller received another patent for the [Magnastat Soldering Iron," which is pretty similar to our welding irons today, and it controls temperature via a magnetic tip. How Does Soldering Work? To start with how the soldering process goes, you need to get acquainted with two pieces of equipment: the soldering iron and the soldering station. In addition to the solder itself, of course! Soldering Iron A soldering iron is an electrical tool that gets hot when plugged into a 120v outlet. It can heat up to 800°F, transferring this heat to electric components like PCB boards and circuits. Then, solder is applied to connect these components. High voltage irons don`t produce more elevated temperatures. They only can heat more significant components. It`s a common misconception among beginners. A soldering iron can take the shape of a pen or a gun. Both forms are available to this day. The pen is easier to use and control. You can change its tip as well, giving you more versatile options. Hence, we recommend this option for beginners. The simplest form of soldering irons is that with no temperature control, which still needs a minimum level of mastery to use. Besides, this makes it not the best option to solder electronic components, where there`s a significant margin of error that we can`t tolerate with such sensitive high priced pieces. Soldering Station The next level is a soldering station. It`s more of an all-in-one device that includes a soldering gun, a hot air gun, and desoldering tools. Its greatest asset is that it allows the user to adjust its temperature precisely. This loosely translates into [a wider range of projects." It`s also considered safer to use a soldering station, as it isolates the heating part from the electrical device, providing you with an integrated soldering environment. Moreover, they have alerts, sensors, and fuses. So you don`t need to be bothered with safety measures. Well, relatively, at least! Solder Traditional solder is an alloy made of tin and lead. It is the actual connective material that joins the electric components together. There is lead-free solder that has a higher melting point than a regular solder. While it`s not as efficient as lead solder, there`s a direction to shift towards it to reduce lead in electronic equipment. Usually, solder comes in the form of thin tubes rolled in spools. The inside of these tubes is a flux that prevents oxidation and cleans the surfaces of pieces to be soldered. Soldering Process Step By Step How Does Soldering Work? Here`s an essential step by step guide on how to solder electronic components: 1. Prepare We`ll start off by prepping. Place the soldering iron on its stand if it comes with one, and plug it in. Make sure that the area you`re working in is well ventilated. While you`re waiting for the iron to heat, you can get a damp sponge to clean the tip of the iron. Moist the sponge and wipe the tip clean. Be careful when you`re doing this step. 2. Melt Start to melt a little part of the solder on the tip of the iron. This will help get the flow going from the iron to the joint. If the solder doesn`t flow, clean it with your damp sponge. Once your iron`s tip is shining bright silver from molten solder, you`re ready to go. No need to repeat this step every time you solder a component. Only on the first component, or when the iron`s tip is dull and needs some solder to flow. 3. Clean You need to prep the surface you`ll be soldering on. Clean the board that you`ll be working on with a woolen cloth, and remove any residue on it. 4. Solder To solder, you need to heat the target connection for a few seconds. Be cautious, and don`t wait for something to melt or change its appearance. Then, apply the solder. You need to hold the soldering iron like you hold a pen. To ensure a robust connection, make sure that both parts to be connected are hot. While you`re applying solder, keep the tip of the iron on the target place. Don`t remove it. If you find solder not flowing, it means that the target pieces aren`t heated enough. If all is well, the solder shall flow smoothly to the heated areas in the connection. 5. Cool Just when you feel like it formed a strong connection. Remove the tip and the solder. Finally, take away the iron. Leave everything to cool down. Don`t move the connection while it`s cooling down. Don`t try to test it at this point. It should take a few seconds. 6. Inspect Look at the joint and make sure it`s stable, and it looks shiny or a bit dull in case of lead-free solder. If the connection doesn`t look and feel solid, reheat the iron and redo it. 7. Finish When you finish up, unplug the iron and wipe its tip clean, when it starts to cool down, of course! 3 Main Types of Soldering There are three types of soldering: soft soldering, hard soldering, and brazing. 1. Soft Soldering (90 °C – 450 °C) This is the most commonly used type of soldering. The one that uses a mixture of tin and leads to join electronic components. It`s also widely used by plumbers. In soft soldering, workers use a soldering iron that`s powered by electricity or gas. The bond produced by soft soldering is a bit weaker than other types. It`s logical, given that it works on delicate material that won`t tolerate high levels of heat. Other solders used are zinc-aluminum to bond aluminum pieces, in addition to lead-silver and cadmium-silver for applications with higher temperatures. Sometimes tin-bismuth is used as well. 2. Hard Soldering (>450 °C) To create a stronger bond, go for hard soldering. This technique is often referred to as [Silver Soldering," where silver or brass are used as solder here. As you might`ve guessed, we`re talking about materials that require a higher temperature to heat. This results in stronger bonds. It`s usually used when the base metals are silver, brass, or glass. 3. Brazing (>450 °C) Brazing is quite similar to hard soldering, where two base metals are heated to a high temperature, then you insert solder to fill in the connection part. It`s also known as capillary action. Somehow, brazing is considered a type of hard soldering. Soldering by Core Types Some people prefer to categorize soldering types according to their core types. In this case, there are also three types: solid core solder, acid core solder, and rosin core solder. Solid Core Solder These are solders with no flux -we`ll be talking about what flux is in the next section, but for now, let`s say it`s a chemical agent that prevents oxidation-. In a solid core solder, the solder is hollow from the inside, requiring an external flux to do the oxidation prevention part. This technique is commonly used by plumbers. Acid Core Solder An acid core solder is one whose hollow core is filled with flux. An acid-based instability, as the name suggests. The acid flux is considered the strongest among flux types and hence, provides better [cleaning action." This technique is usually used with metals and steel. It results in a lot of flux residue that requires cleaning to avoid corrosion afterward. Rosin Core Solder This one is similar to the acid core solder, where the hollow solder has flux inside, but one of rosin instead of acid. Rosin is milder than acid, and it`s not as corrosive as acid. This type is the most used in electronics because of its minimal residue. Because cleaning up residue is nearly impossible in electrical applications. Which Flux Can Be Used for Soldering? Flux is an acidic mixture that helps prevent oxidation of the surface of the components you`ll be soldering. If you`ve seen a soldering gun before, you might recognize the flux as a brown liquid that drips when you heat the weapon. Usually, a flux is a mix of boric acid and alcohol. In electronics, the flux is embedded inside the solder itself, and it`s called a rosin-core or rosin-flux solder. On the other hand, when you use soldering in plumbing, you need a different type of solder with a separate flux. A rosin-core solder is one whose melting point is lower than the metals it`s trying to join together. So that when you heat it, the solder melts, but the metals don`t. The flux doesn`t only provide oxidation, but it also improves the solder`s ability to wet the surfaces it`s joining. The flux also helps eliminate rust from electronic components, which serves well during soldering. One of the most distinctive properties of solder flux is its pungent odor. Thus, it`s always advised to solder in a place with good ventilation. What Is a Soldering Gun Used For? What is a soldering gun used for? A soldering gun is used in various applications where precision and accuracy are required to join pieces together. It`s commonly used by jewelers, electricians, and electronics technicians. In general, a soldering gun is used in applications that a soldering iron would be too big or too hot for. Applications that require precision, as we said. Here are some applications that require a soldering gun: Circuits The most common application for soldering is electronic circuit boards. Soldering is a favorable option here for plenty of reasons; the most important is that the solder allows for smooth electrical conductivity. Besides, it keeps the connections on the surface of the board, so they look neat. Roofing Another well-known application for soldering guns is fusing elements when roofing. Soldering is used in flashing roofs to combine galvanized metals. It`s also used in copper roofs. Jewelry Jewelers need something to fuse elements with the highest precision degree possible. What`s better than a soldering gun? In this case, soldiers usually have high percentages of silver for value and aesthetic reasons. Soldering jewelry requires a high level of skill from workers as they constantly change tips according to the piece they`re working on. Plumbing As we mentioned before, plumbers use soldering to join pipes. In some cases, they use welders, but they'll probably opt for a soldering gun in other instances in which they`re working in tight corners. What Metals Are Used in Soldering? Solder comes from the Latin word [solidarity," which means [to make something solid." The most common solder is the infamous tin-lead solder, which is used in electronic components. However, there`s a wide variety of alloys that are used in soldering. Some of them don`t even include tin. Particular elements can be added to the mix to introduce specific properties. For example, lead-free solder has been trending lately for environmental reasons. Especially when the EU started to restrict the use of lead in electronics. The industry shifted to use some alternatives to mix with tin, like nickel. It`s important to note that lead-free solder has higher melting points than its counterparts, which poses an inconvenience to the electronic equipment industry. To lower the melting point of solder, copper is thrown into the mix sometimes. Bismuth does the same, in addition to enhancing the wettability. On the other hand, silver is used when higher melting points and mechanical strength are required. What Is Leaded Solder? – Advantages and Disadvantages You`ve probably heard about leaded solder if you`ve worked in electronics manufacturing before. It`s one of the most sought-after substances in that field and has been for many years. Leaded solder is a combination of lead and tin, with 40% and 60% percentages, respectively. It melts at 185 °C approximately, and it`s known for its low price. The lead, in particular, caused concern among health professionals due to its known risks to the human body. Nevertheless, leaded solders are still used to bond metal workpieces. People even thought that creating a 50-50 blend was safer, but it didn`t make a difference. Advantages This type of solder isn`t famous for nothing; it has impressive flowing properties. The reason is that it needs a lower temperature to get heated than lead-free solder. Also, leaded solder shines brighter, giving it a more attractive appearance. It also works well for spotting otherwise hard-to-spot issues, such as oxidation. Oxidation can cause a toned-down shine, which will mess with the product`s appearance. Furthermore, the most prominent advantage of leaded soldiers is that they cost much less than lead-free ones. This is the main reason for its vast popularity. Not to mention that it`s much easier to use, which drives a lot of users to go for it. Disadvantages Leaded soldiers have many economic and manufacturing advantages. However, there are still some downsides to using them. Lead is a popular chemical element that has multiple uses in manufacturing car batteries and cable sheathing. Despite that, there have been growing concerns about its effect on human health for a long time. It`s a potent neurotoxin, which means it has direct toxic effects on the user. On top of that, it contains small amounts of radioisotope impurities, which are bad news when undergoing alpha decay. As a result, people use silver instead to overcome the health issues that come with lead. What Is the Difference Between Silver Solder and Regular Solder? While silver solder isn`t the best choice electrically, it has many advantages that earned it a place among the top solders in manufacturing. It`s also the reason for its constant comparison with other soldiers. Silver solder has a higher melting point than regular solders, thereby making it more robust. This also makes it less susceptible to mechanical exhaustion. Besides, it improves its resistance against thermal cycles and high temperatures instead of other types of solders. Blending silver with tin significantly reduces the chance of tin whiskers forming, which are a common occurrence in regular solder. They`re electrically conductive structures that result from tin surfaces. Additionally, they grow in length and cause short circuits, attributed to many system failures later on. Using silver also has its drawbacks compared to regular solder. Many metals cause grittiness, which is the formation of tiny bumps on the solder surface. This won`t happen with standard solder. Also, there`s the biggest obstacle of them all: the high price. What Is the Strongest Solder? The way it is with electronics manufacturing, strength is the most vital feature to look for. This is mainly to avoid seeing any mechanical exhaustion or fabrication problems. That being said, the most effective solder isn`t necessarily the better one. There are many aspects to look for when choosing. What is the most robust solder? The strongest soldier known to date is the silver/tin solder, due to its high melting point, along with the impressive brittleness of silver. When it comes to strength, this solder is hard to match. Nevertheless, silver/tin solders aren`t suitable for all types of electronics. Lead is still the most versatile material. For example, when manufacturing medical or aerospace electronics, leaded soldiers are the obvious choice. They are more reliable than silver-based ones in this case. If there are specific health or environmental demands, lead-free soldiers become the favored choice. That`s because of the lead`s absence, which serves as a significant risk to health. Soldiers are often made of alloys, which means you`re free to choose the right mixture for the electronics in hand. It`s all about identifying the demands for the manufacturing process and optimizing it to get a lower cost. Soldering Safety – Tips and Tricks The extremely high temperature of a soldering iron can be hazardous, so safety precautions are not to be taken lightly here. Soldering irons can start fires. Here are some tips you can -and should- follow when soldering. Make sure to wear loose clothes. Tie your hair back. It`s favorable to wear safety glasses. Always unplug the soldering iron or station when not in use. Don`t work in a closed space. Choose a well-ventilated area to protect yourself from the flux. Never try to touch the iron`s tip when it`s plugged in, even when it`s off, even when it`s not [hot" enough. Try not to inhale the fumes of the flux. These can be highly irritating to your eyes and nose. Using protective gloves is a plus. Keep the cleaning sponge wet during use. Always use hand soap and water to wash your hands after soldering. Cover your skin if you`re used solder that contains lead. Keep a cleaning solution in a dispensible bottle in your workplace. Conclusion We hope we`ve covered everything you needed to know about soldering, the quintessential skill in the field of electronics! One of the things we love about soldering is that you can easily learn even as a hobby! Somehow it`s a staple in every maker`s skill set, and all you need is an iron, and you`re good to go.

PCB prototype is necessary if you are going to make a project for the first time or you want to check the PCB design. You cannot take the risk of mass production before testing PCB. Otherwise, in case of any error in the design, you will have to bear a huge loss. It is very difficult or almost impossible to correct any error in the PCB after manufacturing. A true engineer does not take any risk of losing money without testing the prototype. Thus, the best idea is to take a PCB prototype service before you spend on it. Today, we will discuss some benefits of PCB prototypes and the cheapest PCB prototype service to save your money and time. Benefits of Getting the Cheapest PCB Prototype Service There are dozens of benefit of PCB prototype service, but we will discuss some of them to tell you its importance. Error Free Mass Production It is possible that your first PCB might not work as you desire. So, you can check for any errors after getting the prototype PCB. 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What is FPC? Automotive FPC(Flexible Circuit Board): Flexible printed circuit board is a highly reliable and excellent flexible printed circuit board based on polyimide or polyester film. Referred to as soft board or FPC. Features: It has the characteristics of high wiring density, light weight and thin thickness. It is mainly used in mobile phones, notebook computers, PDA, digital cameras, LCM and many other products. Types of FPC I. Single-Layer FPC It has a layer of conductive pattern produced by chemical etching, and the layer of conductive pattern on the flexible insulating substrate surface is calendered copper foil. Insulation substrates can be polyimide, polyethylene terephthalate, aromatic amide fiber ester and polyvinyl chloride. Single-layer FPC can be divided into the following four sub-categories: 1. One-sided connection without overburden The conductor pattern is on the insulating base material, and there is no overlay on the surface of the conductor. Its interconnection is realized by tin welding, fusion welding or pressure welding. It is often used in early telephones. 2. One-sided connection with overlay Compared with the former, only one layer of overburden is added to the surface of the conductor. When covering, the pad should be exposed. Simply, it can not be covered in the end area. It is the most widely used one-sided soft PCB in automotive and electronic instruments. 3. Double-sided connection without overburden Connecting disc interface can be connected on both front and back of the conductor. A path hole is opened on the insulating base material at the welding pad. The path hole can be made by punching, etching or other mechanical methods at the required position of the insulating base material. 4. Double sided connection with covering layer Different from the former, there is a layer of covering layer on the surface, and the covering layer has access holes, which allow both sides to be terminated, and still maintain the covering layer, which is made of two layers of insulation material and one layer of metal conductor. Ⅱ. Double-sided FPC Two-sided FPC has an etched conductive pattern on both sides of the insulating base film, which increases the wiring density per unit area. Metallized holes connect the graphics on both sides of the insulating material to form conductive paths to meet the flexibility of the design and use functions. The covering film can protect the single and double-sided conductors and indicate the location of the components. According to the requirements, metallized holes and coatings are optional, and this type of FPC is rarely used. Ⅲ. Multilayer FPC Multilayer FPC is to laminate three or more layers of one-sided or two-sided flexible circuits together, through drilling L, electroplating to form metallized holes, forming conductive paths between different layers. In this way, complex welding process is not needed. Multilayer circuits have huge functional differences in higher reliability, better heat conductivity and more convenient assembly performance. Its advantage is that the base film is light in weight and has excellent electrical properties, such as low dielectric constant. Multilayer soft PCB board made of polyimide film as base material is about 1/3 lighter than rigid epoxy glass cloth multilayer PCB board, but it loses the excellent flexibility of one-sided and two-sided soft PCB. Most of these products do not require flexibility. Multilayer FPC can be further divided into the following types: 1. Finished Flexible Insulation Substrate This type is manufactured on flexible insulating substrates, whose products are specified to be flexible. In this structure, the two ends of many single-sided or double-sided microstrip flexible PCBs are usually bonded together, but the central part is not bonded together, so it has high flexibility. In order to be highly flexible, a thin and suitable coating, such as polyimide, can be used on the conductor layer instead of a thicker layer of laminated coating. 2. The finished products of soft insulating substrates are manufactured on soft insulating substrates. The final provisions of the products can be flexible. This kind of multilayer FPC is made of soft insulating materials, such as polyimide film, which is laminated into multilayer plates and loses inherent flexibility after lamination. FPC Manufacturing Process So far, almost all FPC manufacturing processes are processed by subtraction method (etching method). Usually, copper clad foil is used as starting material to form an anti-corrosion layer by photolithography, and a circuit conductor is formed by etching off the unwanted copper surface. Because of the problems such as side etching, the etching method has some limitations on the fabrication of micro-circuits. Based on the fact that the subtraction method is difficult to process or maintain the high qualified rate of micro-circuits, people think that the semi-addition method is an effective method. Various schemes of the semi-addition method have been put forward. An example of micro-circuit fabrication using semi-additive method. In the semi-addition process, polyimide film was used as starting material. First, liquid polyimide resin was cast (coated) on suitable carrier to form polyimide film. Then, the anti-corrosion layer pattern of the inverse pattern of the circuit is formed on the polyimide matrix film by sputtering method, and then on the polyimide matrix film by photolithography, which is called anti-coating. A conductor circuit is formed by electroplating the blank part. Then the corrosion resistance layer and unnecessary phytoplankton layer are removed to form the first layer of circuit. The photosensitive polyimide resin is coated on the first layer of the circuit, and the photolithography method is used to form holes, protective layer or insulation layer for the second layer of the circuit. Then the phytolith layer is sputtered on the first layer of the circuit, which serves as the base conductive layer of the second layer of the circuit. By repeating the above process, a multi-layer circuit can be formed. Ultra-micro circuits with pitch of 5um and through hole of 10um can be fabricated by this semi-addition method. The key to fabricating ultrafine circuits by semi-addition method is the properties of photosensitive polyimide resins as insulating layers.

The invention discloses a novel color tone light LED circuit board, comprising a substrate, the surface of the substrate is provided with a flexible FPC light bar, and the flexible FPC light bar comprises a connection for external power supply. A very white positive terminal, a white negative terminal for connecting an external power supply negative, a series module line for connecting the positive and negative terminals, a white light source, and a warm light source. The invention adopts a substrate, a flexible FPC light bar, a white light positive terminal, a white light negative terminal, a series module wire, a white light source and a warm light source, and the positive and negative alternating currents are input from the power driver, and the circuit board is connected with the positive and negative poles. It can realize double-line color change, dimming, white light on the circuit board, A warm light B can adjust the balance, and can control the light in sections, solve the problem of the three lines input of the prior art power driver, and install The process is simple, saving manufacturing costs. LEDs are appliances that transmit, distribute, and change the light distribution of a source, including all components required to secure and protect the source, except the source, and the wiring accessories necessary to connect to the power source. The lamps are decorated with various places or decorated with festive atmospheres, especially in recent years. With the large-scale use of LEDs, LED lamps are favored by the public for their advantages of energy saving, long service life and good embellishment. It is an important part of the luminaire. The circuit board makes the circuit miniaturized and intuitive, which plays an important role in mass production of fixed circuits and optimization of electrical layout. Common lamp circuit boards In order to achieve the purpose of two-line color change and dimming, the power driver needs three line inputs, and it is not able to control the lights in sections. The installation process is complicated and the manufacturing cost is relatively high. In order to achieve the above object, the present invention provides the following technical solution: a novel color tone light LED circuit board comprising a substrate, the surface of the substrate is provided with a flexible FPC light bar, and the flexible FPC light bar includes a connection for external power supply. a white positive terminal of the positive electrode, a white negative terminal for connecting the negative pole of the external power source, a series module line for connecting the positive terminal and the negative terminal, a white light source and a warm light source, the white positive terminal, the white negative terminal, the series module line, The white light source and the warm light source are connected into an application module of the line LED, wherein the white light source is a single or segmented strip arranged in the application module to form at least one row of monochromatic light beads to form a soft and uniform string connection. a module that can be adjusted or not dimmed or discolored, the warm light source is a string or a plurality of color combinations of light strips arranged in at least one row in the application module to form a soft and uniform string connection. A module that is tuned or not dimmed or discolored. The substrate is a metal substrate Metal substrate is aluminum substrate The components welded between the circuit board and the white light source are fixed by rolling or bonding or fixed by screw on the installation surface of the radiator. The shape of the substrate is circular Compared with the prior art, the beneficial effects of the present invention are as follows: The invention adopts a substrate, a flexible FPC light bar, a white light positive terminal, a white light negative terminal, a series module wire, a white light source and a warm light source, and the positive and negative alternating currents are input from the power driver, and the circuit board is connected with the positive and negative poles. It can realize double-line color change, dimming, white light on the circuit board, A warm light B can adjust the balance, and can control the light in sections, solve the problem of the three lines input of the prior art power driver, and install The process is simple, saving manufacturing costs. Figure 1 is a schematic diagram of the main view of the present invention. Figure 2 is a schematic diagram of the structure of the substrate of the present invention. Figure 3 is a schematic diagram of the structure of the flexible FPC lamp bar of the invention. Figure 4 is a local enlargement of A-A in Figure 3 of the present invention. Figure: 1 substrate, 2 flexible FPC lamp bar, 21 white light positive and negative extremes, 22 white light negative extremes, 23 series module lines, 24 white light Source, 25 Warm Light Source.

Background Technology Light-emitting diode (LED) is directly packaged on PCB board by resin, which can make the LED more miniaturized. This technology has been widely used in LCD backlight, commodity display lighting and automobile lighting, etc. It can meet the requirements of high brightness and long life of LED. In this technology, the effective luminescence of the LED elements is very important to improve the brightness, but the brightness of the LED is often reduced due to the deterioration and discoloration of the reflective surface of the mounted substrate. Therefore, in order to improve the brightness and longevity of the LED, it is necessary to choose a substrate material with high reflection coefficient and not easy to discolor. In practical application, both white LED and high-energy blue LED or the ultraviolet light emitted by them will promote the degradation of the substrate surface and easily cause discoloration. In addition, the thermal shock of curing engineering or reflow welding engineering during installation of packaging resin can easily cause discoloration of the substrate. If the substrate is discolored, it not only reduces the brightness of the LED, but also changes the tone due to the reflected light of the substrate, which affects the lifetime of the LED. Therefore, it is required that the substrate for LED must have a high reflection coefficient, and will not deteriorate due to blue or ultraviolet light, nor will it change color due to heating. The current market of the substrate can not meet this requirement. Weld resistance coating is an insulating and protective coating material for PCB surface layer. The solder resistance film is responsible for preventing unnecessary solder attachment on the surface of the circuit and short circuit of the circuit when the components are installed. At the same time, as a permanent protection circuit graphics from dust or heat, humidity and other external environment, to maintain the insulation between the circuits. Therefore, the welding resistance film must have various qualities, such as insulation, heat resistance, resistance to resistance, moisture resistance, reliability and adequate hardness to scratch. A method for manufacturing an LED circuit board includes the following steps: A. To adapt to the size of circuit boards, copper foil is fed, and solder resistance ink is printed on the surface of copper foil. B. Two copper foil inks with good solder resistance printing ink face inward, and PP sheets are placed in the middle for pressing. C. Laser drilling; D. Deposition of copper and electroplating; E. External circuit fabrication. Supplementary Notes Step a also includes the steps of baking the solder resist ink. Step a uses white or black solder resist ink, and the ratio of the solder resist ink to boiling oil water is 1:0.01~0.03. Step a adopts 77T white screen printing plate. Step a chooses one of the surfaces to be coated with copper foil with aluminum foil, and solder resistance ink is printed on the surface of copper foil without aluminum foil. In step a, the thickness of solder resist ink is over 30um. Step C also includes the steps of opening copper windows by acid etching of inner layer before laser irradiation. Step E also includes the steps of dry film pretreatment by ultra-coarsening and AOI detection by single-machine scanning after circuit fabrication. After the outer circuit is fabricated, the gold-converting step is also needed. In step d, copper was deposited twice in succession. The LED circuit board manufactured by the method can cover insulating substrates with 100% ink. The LED circuit board manufactured by the method can be used in commercial lighting, high-end automobiles, aerospace, military and other lighting places with high-reliability requirements, effectively avoiding deterioration and discoloration of substrates. Specific implementation methods The specific process of the manufacturing method of the LED circuit board is as follows: Cutting of CA copper foil on the first side and on the second side→Printing anti-welding ink on copper foil→Bake→Drilling rivet hole→Two layers of copper foil with PP sheet pressed in the middle→Drill board edge tool hole→Remove aluminium foil from CA copper foil→Laser opens the copper window→Laser Drilling→Copper Deposition and Hole Filling Electroplating→Graphic Circuit Making→etching→AOI detection →Immersion Gold→Forming. Firstly, the copper foil as the circuit layer is fed. In this example, the CA copper foil is used to fabricate the LED pad and circuit by etching process. CA copper foil refers to the structure of a layer of aluminium foil on a layer of copper foil. Aluminum foil can increase the overall hardness of copper foil, realize the printing of anti-welding ink for ultra-thin copper foil. At the same time, aluminium foil can also protect copper foil from PP powder and other impurities pollution during pressing. The adhesive between copper foil and aluminium foil is made of material with high temperature peeling property. Only one circle is coated around the edge of the plate. After laminating at high temperature, the adhesive will crack with the copper foil, which is convenient to peel off the aluminium foil. The adhesive can be peeled off together with the aluminium foil to avoid colloid residue on the copper foil. Of course, common copper foil can also be used in this step. Copper foil is printed with anti-welding ink on the surface of copper foil after uncovering, which is used to protect insulating substrates, and black or white anti-welding ink is preferred. Black has the best light-resisting property, but its reflectivity is low and white reflectance is high, but its light-resisting property is not as good as black ink, so it can be selected according to the needs of actual terminal products. After selecting the ink, it should be mixed with boiling oil and water in a certain proportion. The ratio of general ink to boiling oil and water is 1:0.01-0.03. After mixing, it should be stirred for 15-30 minutes, and then it can be printed on the computer for 15 minutes. If black ink is used, the ratio of black ink to boiling oil water is 1:0.02; if white ink is used, the ratio of black ink to boiling oil water is 1:0.03. When printing, 77T white screen is preferred for the screen plate of anti-welding wire printing, which can effectively avoid the problem of ink sticking to the screen. The thickness of anti-welding ink for printing should be controlled above 30um. After silk printing with anti-welding ink, the ink is kept for 20-30 minutes, then baked at 150 C for 1 hour, so that the ink can be fully cured. In the process of pressing, the intermediate PP sheet is preferred to be BT resin with good heat resistance and wear resistance, low dielectric constant and low dielectric loss. A PP sheet is arranged in the middle of the two layers of copper foil, and one side of the copper foil printed with solder resistance ink is pressed towards the PP sheet. The number of PP sheets can be determined according to the thickness of finished products, but at least one must be placed. After pressing, drill the tool hole at the edge of the plate, and then remove the aluminum foil layer. The aluminum foil can be recycled and reused. In the process of laser opening copper window, only one copper foil is needed to laser the copper window to facilitate laser drilling and adjust the laser parameters so as to avoid laser drilling breaking through the other copper foil. Copper window data diameter design and radium perforation aperture are large. After etching, it is necessary to ensure that the tolerance of window opening diameter is within +/-0.5mil. Inner acid etching is preferred for copper window etching. No browning process is needed before laser drilling. After laser drilling, special AOI is needed to check whether the residual glue and another layer of copper foil are broken. In the electroplating process of copper sinking and hole filling, the horizontal copper sinking wire is adopted, the first copper foil is facing down, so as to avoid Tibetan medicine, and the non-special thin plate wire needs to be added with strips to prevent the clamping. Continuous sinking twice to ensure that copper is deposited on the insulating hole wall and ink. Special plating auxiliary frame should be used for filling hole electroplating to avoid jamming and breakage. After filling holes, slices should be made to confirm the blind hole depression, and the quality of the subsequent LED chip packaging should be guaranteed within 0.5 ml. In addition, to improve the quality of copper deposit, a plasma and a degumming treatment are needed. The next step is to etch the copper foil. Because the surface circuit of LED carrier plate products is usually only pad and copper foil, there is no precise circuit, no need to re-screen the anti-welding layer, directly cover the dry film etching circuit, the surface of the circuit is preferred to nickel-gold treatment. Ultra-coarsening is preferred in the pretreatment of dry film, and no grinding is allowed. LDI exposure machine is preferred for exposure, PE value is controlled by (+50um) to ensure line accuracy, acid etching is preferred to improve the uniformity of etching line and shorten the production process. After line etching, AOI detection is carried out, and single machine scanning is used to prevent the board from creasing and breaking when line scanning is completed. In the process of gold alloying, copper foil must be retained on both sides of the auxiliary side in the design, so as to increase the hardness of the plate edge and prevent vibration damage during gold alloying. The edge of the board should be added with a gold bead hole every 100-200 mm, and the two short edges of the board should be added with priority. The diameter of the hole is 1.5-3.2 mm, which ensures that the board can be fixed when gold is melted. All bead holes are preferred to use Teflon wire string isolation beads, so that the board and the board are separated and fixed well. The PTH holes are made without cutting copper around tool holes and positioning holes at the edge of typesetting board, so as to prevent deformation and damage of the hole edge. The method adopts special CA copper foil to realize silk printing of anti-welding ink to block LED light on the copper foil, and press the anti-welding ink under the copper foil of the circuit layer to realize 100% covering of the insulating base material, protecting the insulating base material, effectively avoiding the deterioration and discoloration caused by the LED light, so as to improve the brightness and service life of the LED. In practice, copper sinking and electroplating can be realized by using strips and special plates and frames. The gold-plating process can effectively guarantee the quality of the gold-plating process by adding bead holes separately and retaining copper foil at the edge of the plate.

JingHongYi PCB is a professional PCB manufacturer and a leader of Multilayer PCB manufacturing in Shenzhen, China. JingHongYi PCB leads the China printed circuit board industry in quality and innovation by providing Prototype PCB and full-service PCB fabrication to meet the most rigorous custom PCB requirements. We provides some of the most advanced PCB manufacturing capabilities in the industry, our PCB manufacturing capabilities range from simple PCB prototypes to advanced PCBs with tight tolerances, high layer count (up to 40 layers), heavy copper (up to 20 oz.), and more. It meets even the strictest requirements for medical, commercial, defense and aerospace applications. Stable and Reliable Materials for Custom PCB Fabrication Depending on the product application for which a custom PCB is being designed for, advanced laminate materials may be required. JingHongYi PCB sources a broad range of PCB laminate materials to meet your specifications from leading providers such as 3M, Arlon, Rogers, Ventec, Isola, and Bergquist to name a few. Our custom PCB material options include: RoHS Compliant Halogen Free RF Materials Advanced RF Materials Advanced HDI Advanced Signal Integrity Available Laminate Materials for Multilayer PCB Manufacturing We offer many laminate material options for your multilayer PCB requirements including the following: FR4 for Multilayer PCB Standard FR-4: Up to 40 Layers Isola FR406: Up to 40 Layers Halogen Free Laminates for Multilayer PCB Designs Ventec VT-441, VT-447: Up to 40 Layers Isola Terragreen: Up to 40 Layers RoHS Compliant Materials for Multilayer PCB ITEQ IT-180A: Up to 30 Layers ISOLA 185HR: Up to 30 Layers ISOLA 370HR: Up to 40 Layers FR408HR: Up to 40 Layers ISOLA I-Terra MT (RF/MW): Up to 40 Layers Nelco BT-N5000: Up to 30 Layers Nelco 4000-29: Up to 40 Layers Nelco 4000-13 & 13SI: Up to 40 Layers Nelco 4000-13EP & EPSI: Up to 40 Layers Polyimide: Up to 40 Layers Cyanate Ester: Up to 20 Layers RF Materials for Multilayer PCB Designs Rogers 3000 Series (FR4 w/ RO3000 Caps): Up to 20 Layers Rogers 4003C & 4350B: Up to 20 Layers Rogers 5870/5880: Up to 8 Layers Isola IS680: Up to 40 Layers I-Terra RF MT: Up to 40 Layers Isola Astra MT77: Up to 40 Layers Rogers 6000 Series: Up to 4 Layers Rogers Diclad 880: Up to 20 Layers Rogers AD300A: Up to 20 Layers Rogers CuClad 280: Up to 20 Layers Rogers CTLE: Up to 20 Layers Isola I-Speed: Up to 40 Layers Arlon Genclad 280: Up to 10 Layers Arlon LX250: Up to 10 Layers Arlon GYN 2.17 DK: Up to 10 Layers Advanced HDI & Signal Integrity Laminates Rohacell: Up to 12 Layers Isola Tachyon 100G: Up to 40 Layers Isola I-Terra MT 40: Up to 40 Layers Advanced PCB Plating Capability The plating finish applied to a printed circuit board consists of metal deposited to the exposed copper and plated thru holes in a chemical process. Custom PCB design engineers are able to specify the surface finish required after carefully considering cost, shelf life, solder rework capabilities, solder wettability, solder joint integrity, RoHS compliance, and any other attributes the different options provide to best suit the custom PCB`s intended application. JingHongYi PCB custom PCB surface finish options include the following: Leaded & Lead Free (HASL) Electroless Nickel Immersion Gold (ENIG) Electrolytic Nickel & Hard Gold Plating Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Immersion Silver & Immersion Tin Plated Nickel Fused Tin Lead Electroless Nickel Soft Bondable Gold

JingHongYi PCB is is the leading PCB manufacturer with in-house prototype manufacturing and assembly services to provide a one-stop solution for your turnkey PCB prototyping needs. Offers the convenience of a one-stop for PCB manufacturing and assembly services. Our customers rely on our expanded capabilities, certifications, and in-house assembly services to meet all their PCB design requirements for both quickturn prototypes and production runs. Our quickturn capabilities, no minimum quantity requirements, and the best on-time shipping record, makes Advanced Circuits your best choice for turnkey PCB prototyping. Our PCB assembly services includes: Quick Turn PCB Assembly Low Volume & Small Batch PCB Assembly Turnkey PCB Assembly Service Low Cost PCB Assembly High Volume PCB Assembly Middle Volume PCB Assembly Lead Free PCB Assembly Multilayer PCB Assembly LED Lighting PCB Assembly Prototype PCB Assembly Services Flexible PCB Circuit Board Assembly Double Sided PCB Assembly Here are just a few reasons to choose JingHongYi PCB'in-house PCB assembly services for your next turnkey prototypes: PCB + Assembly As Fast As One Day Superior Quality Assurance One Seamless Process Easy Parts Procurement Single Vendor No Set-Up Fees & No Stencil Charges Industry`s Best On-Time Shipping Record 24 Hour Tech Support JingHongYi PCB Board Assembly Capabilities JingHongYi PCB maintains a reputation for high quality, reliability, and a hands-on approach to customer service. This is what you can expect from our assembly services along with industry leading certifications and capabilities. Assembly Turn Times Same day through four week turns Scheduled deliveries Technology Surface mount (SMT) Thru-hole Mixed technology (SMT/Thru-hole) Single or double sided placement Stencils Laser cut stainless steel Nano-coating available Passive Components As small as 0402 package As small as 0201 with design review Ball Grid Arrays (BGA) As small as .35mm pitch All BGA placements are x-ray inspected Fine Pitch Components As small as 15 mil pitch Volume No minimum order quantity Engineering prototypes Low cost first article builds PCB Assembly capabilities include both surface mount technology (SMT) and thru-hole manual assembly. Our quickturn prototype assembly service supports fine pitch components as small as 15 mil pitch, passive components as small as 0201 package, and ball grid arrays (BGA) as small as .4mm pitch with X-Ray inspected placements. Solder types include leaded and lead-free RoHS compliant and we use laser-cut stainless-steel stencils (nano-coating available).

Printed circuit boards are the mother of all electronic products. Printed circuit boards are the core of all electronic products. Since the beginning of the last century, the use of printed circuit boards has made great progress. According to different application scenarios and usage requirements, PCB also presents a variety of features, and the manufacturing process is also very different. Jinghongyi PCB is a professional PCB manufacturer with rich PCB manufacturing experience and extensive PCB manufacturing capability to meet the quality, precision, and performance demands for the latest technology requirements. Below is a list of the several common types of printed circuit boards you should know. Single Layer PCB Single layer printed circuit boards are among some of the simplest to design and manufacture. These boards have a single layer of conductive material (such as copper) on only one side of a non-conductive substrate. Double Layer PCB Double layer PCBs have one conductive layer on top of a non-conductive substrate and another conductive layer on the reverse side (top and bottom layers). The two conductive sides can be connected using plated holes in the substrate that connect to pads on both sides of the circuit board; these are called vias. Multi-Layer PCB This term refers to a circuit board that has three or more conductive layers. The conductive layers are at the top and bottom, as well as at least one conductive layer sandwiched between non-conductive substrate. Advanced Circuits has the capability to fabricate up to 40 layer boards, but the most commonly used have lower layer counts such as 4, 6, or 8 layer boards. High Density Interconnect (HDI) PCB HDI PCBs take advantage of precision based manufacturing technology to pack as much functionality into a small space. This is done by using many conductive layers, laser drilled microvias, fine lines and tolerances, and advanced laminate materials. HDI PCBs can accommodate the complex routing of high pin count chips and other high-tech miniaturized components. High Frequency PCB The main difference in manufacturing high frequency printed circuit boards pertains to the design itself. These PCB are designed to facilitate signals over 1 gigahertz. Depending on the application, high frequency printed circuit boards may require the use of advanced laminate materials and controlled impedance. LED PCB LED PCB has many other names, such as LED PCB board, LED circuit, LED Circuit Board, led printed circuit boards, PCB board for LED. In a sense, LED PCB and Aluminum PCB belong to the same kind of PCB products, because their uses and materials are mostly the same. With the popularization and widespread use of industrial lighting and civil lighting, whether outdoor or indoor, family or commercial buildings and factories, lighting provides the guarantee of its normal operation. Flexible PCB lexible PCB, also known as Flexible electronics, flexible circuit board, Flex PCB , flex circuits, is a technology for assembling electronic circuits by mounting electronic devices on flexible plastic substrates, such as polyimide, PEEK or transparent conductive polyester film. Additionally, flex circuits can be screen printed silver circuits on polyester. Flexible electronic assemblies may be manufactured using identical components used for rigid Printed Circuit Boards, allowing the board to conform to a desired shape, or to flex during its use. An alternative approach to flexible electronics suggests various etching techniques to thin down the traditional silicon substrate to few tens of micrometers to gain reasonable flexibility, referred to as flexible silicon (~ 5 mm bending radius). Impedance Control PCB Impedance control has been one of the essential concerns and tough problems in high-speed PCB design. Impedance is the sum of the resistance and reactance of an electrical circuit. The resistance being the opposition to current flow present in all materials. In high frequency applications, controlled impedance helps us ensure that signals are not degraded as they route around a PCB. Resistance and reactance of an electrical circuit have a major impact on functionality, as certain processes must be completed before others to ensure proper operation. Gold Fingers PCB In today's computerized and mobile-activated world, signals are sent between numerous devices. For each command to be enacted, communication must be made between two or more circuit boards. None of this would be possible without gold fingers, which serve as the connecting contacts between motherboards and components like graphics or sound cards. JingHongYi PCB manufacturing capabilities range from the simplest of designs to the most complex builds with rigorous design requirements. Our capabilities include laser-drilled microvias, cavity boards, heavy copper up to 20 oz., via-in-pad, microwave & RF boards, up to 40 layers and others. We are your one-stop solution to all of your printed circuit board manufacturing. For more information about our PCB capabilities and services, contact your Sales Representative or Send email to us.

Each industry has its own specific and professional terms, and PCB design and manufacturing are no exception.Printed circuit boards exist in household appliances used in our daily life, such as refrigerators, televisions, cars, microwave ovens, computers, printers, mobile phones and so on. Printed circuit boards are packed with different features and elements that make their design and functionality unique for their particular application. In this post we list key printed circuit board design terms that are commonly used in the electronic design industry. For a complete list of printed circuit board design and manufacturing terms, please visit our online Glossary. PCB Design & Fabrication Terms Annular Ring – That portion of conductive material completely surrounding a hole. Array – A group of elements or circuits arranged in rows and columns on a base material. DRC – The acronym in the circuit board design and fabrication industry stands for [Design Rule Check". Similar to DFM which stands for [Design For Manufacturing". Finger – A gold-plated terminal of a card-edge connector. (Derived from its shape.) Mouse Bites – These are also known as perforated brake-away tabs in printed circuit boards and are an alternative to v-scoring. Pad – The exposed metal on a printed circuit board design that is intended to connect a component. Panel – Material (most commonly an epoxy- copper laminate known as FR-4) sized for fabrication of printed circuit boards. The standard size at Advanced Circuits is 18″ x 24″. Paste Stencil – Stencils ensure the right amount of solder paste is applied to achieve optimal electrical connections. See why Advanced Circuits` stencils can help you apply the exact amount of solder paste to your printed circuit boards. Pick and Place – The machine used to automatically place components on a printed circuit board. This process is also known as SMT which stands for [Surface Mount Technology". Review our full list of PCB assembly capabilities to learn more. Plane – Also known as a copper pour. Rather than copper in the form of a path or trace, a Plane is a continuous area of copper in a printed circuit board design. Plated Thru Hole – A hole in a PWB with metal plating added after it is drilled. Its purpose is to serve either as a contact point for a through-hole component or as a via. Silkscreen – The decals and reference designators in epoxy ink on a printed wiring board so called because of the method of application – the ink is [squeegeed" through a silk screen, the same technique used in the printed of T-shirts. Minimum line width at ACI for silkscreen is .008. Also called [silkscreen legend". Slot – Elongated holes in the circuit board that may be plated or non-plated. Trace – A continuous path of copper on a printed circuit board that is the equivalent of a wire for conducting signals. V-Score – A v-shaped groove cut into both the top and bottom of the boards for break-a-way. To view our complete online glossary of printed circuit board design and fabrication terms, click here.

Science and technology are progressing with the times.The improvement of human productive capacity also promotes the rapid development of all walks of life. Military, medical, health, household appliances and other products closely related to us are becoming more and more intelligent. Automobile, as our transportation tool, is developing towards safety and intelligence more and more.The development of automobile industry also promotes the development of automobile PCB industry. Let's take a look at the in-depth application of automotive PCB. Modern Applications in the Automotive Industry Technology has become firmly integrated into all facets of our lives – including our automobiles. The demands for safety, convenience, and connectivity require circuit board design to keep pace – if not stay a step ahead. Advancements in the automotive industry meant PCB applications had to accommodate these complex systems. All new cars require computers to operate. PCBs are at the heart of these system designs and can range in type – including single-sided PCB, double-sided PCB, multilayer PCB, rigid PCB, flexible PCB, and so on. They cover a broad range of applications that are spread throughout a vehicle`s operating systems. Trucking & Delivery Industry The initial investment is only the beginning, as there are expenses involved in keeping any vehicle roadworthy. This is particularly true of large trucks that spend their days traversing the nation`s highways. It`s been stated that as much as 43% of the operating cost of a commercial truck is putting a human in the driver`s seat. With costs continuing to rise, it`s no wonder that the industry has shown great interest in self-driving technology. Personal Automobiles While the trucking industry might be looking at autonomous vehicles as a means to save on costs, the consumer market seems focused on other goals. Today, personal automobiles offer incredible technological capabilities made possible by printed circuit board systems. Convenience is certainly a factor. Still, it`s the potential benefits of safety that make the promise of self-driving cars so attractive. Many auto manufacturers are investing heavily in the future of this technology. It`s not a matter of if but when we`ll see cars driving themselves. For now, personal automobiles offer precursors to self-driving systems, that take full advantage of PCB technology. Powertrain Components An automobile`s engine, transmission, and other components have various electronic control modules. As powertrain designs require more functionality, the number of modules must also increase. Without this medley of synchronized computers, your car wouldn`t get very far down the road. Comfort and Technology Features It`s easy to surmise that automotive features like smart keys and navigational systems require computers. Less obvious ones – including numerous sensors and the automatic braking system – are also peppered throughout modern automobiles. Advanced Driver Assistance Systems ADAS systems are electronic safety measures that provide state-of-the-art protections. These system safeguards – video cameras, radar receivers, and other sensors – enhance the driver`s ability to avoid potential accidents. Dawn of the Autonomous Vehicle Revolution Imagine a future where a self-driving car stops to pick up passengers. The autonomous drone navigates the roadways along a preset destination – while managing to avoid plowing into anything along the way. Sound like something in a science fiction movie? Fiction tends to become reality eventually. Autonomous vehicles already exist. In fact, many segments of the industry are actively testing this technology. Their wide-spread and commercial use are just around the corner. Printed Circuit Boards in the Self-Driving World Regardless of the industry, the move to autonomous vehicles requires advancements to make it happen. Printed circuit boards are more than an essential part of the equation – they`re a requirement. Though technology has helped alleviate human errors that generally cause accidents, people are still skeptical about allowing machines to pilot themselves. A combination of reliable software and hardware is required to ensure as failsafe of a system as possible. PCB Technology Pushes the Envelope of Emerging Innovations The automobile had already grown into a complex collection of systems and software – even with humans at the controls. With the ambition of having vehicles take over the driving as well, it`s paramount that the brains of these decision-making vehicles are of the highest quality. PCB manufacturing and assembly companies, such as JingHongYi PCB, are positioned to be key contributors. All of these are based on the development of printed circuit board design. Printed Circuit Board Design Advancements From hobbyists to the aerospace industry, the applications of the printed circuit board have grown over the years. As these expand, so does the need for advancements in material and capabilities. This trend is expected to continue for the foreseeable future. Imagine the world before the advent of the Information Age. Before smartphones and the internet craze, PCBs were already widely used – from toys to fighter jets. There was a time when pocket calculators were considered high-tech. As society grew more dependent on technology, newer innovations continued to be introduced. Moving forward into the new century, electronics have become more powerful, compact and mobile. People have grown accustomed to being connected. The advances that provided greater connectivity also required more to be packed into each PCB. JingHongYi PCB, the leader of the automobile PCB manufacturers In an impatient world awaiting the self-driving car, it makes sense to let a leader in PCB technology take the wheel. Since 2011, JingHongYi PCB has been a leader in printed circuit board manufacturing and assembly. As one of the largest manufacturers of circuit boards in the ShenZhen, China, JingHongYi PCB is renowned for quality, reliability and customer service. One of the few professional PCB suppliers, JingHongYi PCB manufactures 100% of their boards in China. Along with the best on-time PCB shipping record, there's also 24-hour tech support (where you'll get a live person). Contact us today to discover our advanced PCB manufacturing capabilities.

Creating a Printed circuit board can be a complex process beginning with the design itself. With advancing and progressive technology, the processes have become increasingly simplified with the help of PCB design software and innovations in the PCB manufacturing industry. JingHongYi PCB is the leading PCB manufacturer known for its high quality and innovation. We offer expanded circuit board manufacturing capabilities, quickturn circuit board prototyping services, and in-house circuit board assembly. JingHongYi PCB is the best choice for all your PCB manufacturing needs, especially for demanding requirements that call for advanced precision and expanded capabilities. PCB manufacturing for both production runs and small quantity prototyping with JingHongYi PCB'broad range of services, such as quickturn expedite options, free PCB design tools, and in-house PCB assembly, make for a smooth and worry-free process. JingHongYi PCB' manufacturing factory have the capabilities and advanced industry certifications to handle PCB fabrication of many different types of circuit boards; including PCBs for military/aerospace, medical, and commercial applications. What is a Printed Circuit Board (PCB)? The purpose of a circuit board is to hold copper circuitry (or trace) to conduct signals equivalent to the way a wire would, while acting as the physical support to mount the independent electronic components it connects together for a desired function. The copper trace etched on the circuit board supplies the direct connection. The material used as the foundation for circuit boards is customarily glass-reinforced epoxy laminate, but there are many different types of laminates that can be used to support different circuit board requirements and end-use specifications. A PCB is the electronic device`s skeletal frame and a solid base. A PCB possesses electrical interconnections amid the mechanisms. There are a variety of circuit board types including: single-sided (one copper layer), double-sided (two copper layers), and multi-layer (inner and outer layers), microwave and RF circuit boards and more. The 2 layer and multi-layer PCBs rank among the most popular and can harbor 40 or even more stacked conductive layers into a single circuit board. How Does a pinted Circuit Board (PCB) Work? Circuit boards are engineered to for many different applications and every circuit board design is intended to connect different electronic components to achieve a desired result, but most circuit boards make use of the following common components to manipulate electrical conductivity: Capacitors – Store the electric charge of the circuit board Resistors – Provide set amount of electric current resistance Inductors – Stores energy as a magnetic field Diodes – Enable the electric current to move in one direction Other essential elements found in circuit boards are: Copper – The copper layer is essential to the PCB and are thinner than its counterparts. The copper is responsible for carrying the electric charge. Via holes are drilled by precise drilling instruments and cleaned to ensure they do not become clogged. Electric charge flows through these holes and is carried between each layer of the PCB. Solder Mask – The last layer protects the copper and metal from damage. The solder mask provides a protective plating, which is usually green in color, but it can be any other color. Common Types of PCBs ● Single Layer PCB A single layer PCB can also be referred to as a single-sided board. These boards possess a conductor pattern on one side only and may have non-conductive components on the opposite side of the board. The board is comprised of merely one layer of a conductive metal layer (usually copper), finishing with a shielding solder cover called Solder Mask. These single layer PCBs are most commonly found in more simple electronics. ● Double Layer PCB Also known as double-sided boards, these PCBs possess two conductive copper sides on opposite sides of a non-conductive substrate. The two sides may be connected to each other by small plated thru holes known as vias that let signals pass through from one conductive side of the board, through the non-conductive substrate, to the other side. ● Multi-Layer PCB Three or more conductive layers in a PCB is commonly called a multi-layer PCB. A multilayer board is fabricated by using epoxy resin, immense pressure and precision. Materials used in the lamination process include: inner layer core, sheets of [prepreg" (woven glass cloth with epoxy resin), and sheets of Cu foil. Once cured, the resin will join the glass sheets, core, and foil together into the multilayer PCB panel. Advanced Circuits is able to manufacture up to 40 layers boards. ● High Frequency PCB Each design of high frequency PCBs differs from the next. These boards were designed and created to carry electronic signals comprised of over 5 Gigahertz and require advanced PCB laminate materials for optimum performance. High frequency PCBs found in high-speed electronics and advanced technology communication products. Advanced Circuits works with top PCB laminate providers to bring you a wide range of material options such as high-frequency ceramic filled laminates, and other suitable materials for high frequency applications. ● High Density Interconnect (HDI) PCB HDI PCB manufacturing requires an advanced level of technical expertise and the latest state-of-the-art equipment for exacting precision. Fitting more technology in less space through miniaturization, multiple conductive layers, advanced components, and lasered through-holes offer steady and rapid processing on a much smaller scale than its counterpart boards. Advanced Circuits achieves high quality and precision with in-house laser drill capabilities that include precise depth control. Laser direct imaging (LDI) capabilities ensure exacting registration and all multilayer inner cores receive a thorough check using Automated Optical Inspection units for excellent defect detection of the finest features. ● Rigid PCB Rigid PCB is a kind of Printed Circuit Board, and is the largest number of PCB manufactured. It is made of solid substrate material, which can effectively prevent the distortion of the circuit board. Perhaps the most common rigid PCB is the computer motherboard. The motherboard is a multi-layer PCB designed to distribute power from the power supply while allowing communication between all components of the computer, such as CPU, GPU and RAM. ● Flexible PCB Flexible PCB, also known as Flexible electronics, flexible circuit board, Flex PCB , flex circuits, is a technology for assembling electronic circuits by mounting electronic devices on flexible plastic substrates, such as polyimide, PEEK or transparent conductive polyester film. Additionally, flex circuits can be screen printed silver circuits on polyester. Flexible electronic assemblies may be manufactured using identical components used for rigid Printed Circuit Boards, allowing the board to conform to a desired shape, or to flex during its use. An alternative approach to flexible electronics suggests various etching techniques to thin down the traditional silicon substrate to few tens of micrometers to gain reasonable flexibility, referred to as flexible silicon (~ 5 mm bending radius). ● Rigid-flex PCB Rigid Flex Printed Circuit Boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation. ● Ball Grid Array (BGA) PCB OEM needs smaller and more diverse packaging options to meet product design challenges and maintain cost competitiveness in their respective markets. Ball grid array (BGA) packaging is becoming more and more popular to meet these design requirements. In addition, they are ideal solutions, because I/O connections are located inside the device, increasing the ratio of pins to PCB area. In addition, BGA with strong solder balls is stronger than QFP lead, so it is more robust. ● High Tg PCB Tg means Glass Transition Temperature. As flammability of printed circuit board (PCB) is V-0 (UL 94-V0), so if the temperature exceeds designated Tg value, the board will changed from glassy state to rubbery state and then the function of PCB will be affected. If working temperature of your product is higher than normal (130-140C), then have to use high Tg material which is > 170C. and popular PCB high value are 170C, 175C, and 180C. Normally the PCB Tg value should be at least 10-20C higher than working temperature of product. If you 130TG board, working temperature will be lower than 110C; if use 170 high TG board, then maximum working temperature should be lower than 150C.

Need to have your prototype PCBs assembled to receive turnkey circuit boards? Finding the right partner for your prototype assembly is crucial. Printed circuit board assembly, also known as [stuffing" or [populating the bare printed circuit board" is quite an intricate process involving many different phases. JingHongYi PCB is the leading PCB manufacturer that offers quickturn PCB prototype manufacturing and with in-house prototype assembly services for your small quantity needs with no minimum order requirements. Why should PCB assembly start with Prototype PCB assembly? Some design engineers choose to go straight to production after designing and manufacturing a PCB; this, however, is not wise. There are many issues that may arise in the many stages of fabrication, assembly, and testing. Here is why it is important to start with low quantity prototype assembly: Cost – Prototype assembly of your first prototypes can lead you to discover ways to reduce costs in manufacturing and assembly of your circuit board; plus, mass producing a design with flaws can cost a fortune. Discover Design Flaws – PCB prototypes may help you discover design flaws that can be corrected before your production run. Proper Testing – Testing ensures proper functioning of your PCB design and reduces the risk of errors prior to production. How to find the right prototype PCB assembler? Before embarking on the design and production of a PCB prototype, it is crucial to select the right prototype assembly partner. Here are important questions to make the proper selection: Does the PCB assembler internally manufacture the bare printed circuit board? Will all or some parts of the manufacturing be sub-contracted to third-party? Does the PCB assembler have technical experience and capabilities for your circuit board design requirements? Does the assembler have direct and prompt access materials and components needed? Can the PCB prototype assembler produce the pieces by the required timeline? What information does the PCB assembly order need to provide? Prior to a PCB prototype assembler beginning a new project, the majority will require this relevant information: Amount of prototypes needed PCB Gerber files Bill of Material (BOM) detailing all components Precise timeline of prototype turn-around After receipt of the necessary information, assemblers can review the material and determine if they can properly meet the deadlines and specific execution of the PCB prototype. Solder Paste – Solder paste is a combination of flux, a chemical created to assist in the bonding and melting of the metal, and small fragments of metal (solder) in order to apply the electronic components to the printed circuit board. The paste is placed on the board in specific places along the board in exact amounts with the use of a Solder Stencil and a paste application machine, automatically. When an automatic machine is not available to you, it must be executed manually and with the utmost precision. Pick and Place Machine – This machine is essential in an automated printed circuit board assembly process. The machine is programmed to automatically coordinate with complete accuracy the places to precisely mount each electronic component to be soldered to the printed circuit board. These machines are exact and quick. Human pick and place has a much higher potential for errors in addition to being a much slower, more tedious process. Infrared Reflow – After the precise bonding element (solder paste) is applied to the PCB, the board will be directed to the reflow oven to join the electronic components to the board by melting the solder paste. This [oven" is comprised of many heaters whose main function is to heat the board to a precise temperature and control the level of cooldown as the solder hardens. This process is crucial to the creation of properly functioning electronics. The printed circuit board will run through a series of testing to ensure no issues or short-circuiting nor misalignments have occurred. Thru-hole PCB Assembly – A method of soldering electronic components in place by hand using drilled holes in the printed circuit board and connecting pads. This technique creates a stronger physical bond of the component to the printed circuit board but is much more time consuming and the cost of the printed circuit board can increase due to the higher volume of drilled holes.

HDI PCBs are increasingly becoming more common as consumers demand for smaller and more capable electronics grows and electronic design engineers push the limits of technology. HDI PCBs, short for High Density Interconnect printed circuit boards, take a great deal of precision to manufacture using specialized equipment and the skills of highly trained technicians. Unlike most traditional circuit boards, HDI PCBs have extremely thin lines, much tighter tolerances, high conductive layer counts, and a higher concentration of pads in a smaller area to fit more (and smaller) components on both sides of the circuit board to achieve a greater level of functionality and performance from a single circuit board. HDI PCB Fabrication Capabilities JingHongYi PCB (HongKong) Co., Limited in China with the capabilities, qualifications, certifications, and the expertise to meet the most demanding requirements for HDI PCB fabrication. Our broad range of printed circuit board fabrication capabilities support the stringent requirements for advanced HDI PCB design in all industries including medical, aerospace, defense, and commercial markets. JingHongYi PCB Supports up to 40 layers Multilayer PCB boards, laser drilled microvias, stacked microvias, blind vias, buried vias, via-in-pad, laser direct imaging, sequential lamination, .00275″ trace/space, fine pitch down to .3mm, controlled impedance and much more. JingHongYi PCB is able to manufacture HDI PCBs with no minimum order requirements and with flexible turn-time options. Each design receives a detailed review by our CAM engineers prior to production to ensure a worry-free fabrication process and support team is available 24 hours a day Monday-Sunday to assist with your HDI PCB order. HDI PCB Materials HDI PCBs use advanced laminate materials that tend to be much thinner than the materials used in more conventional printed circuit boards. Because HDI PCBs demand an elevated level of precision and accuracy for fabrication and overall performance, specialty materials that meet certain specifications are required. JingHongYi PCB offers a wide range of material options suitable for a variety of HDI PCB specifications sourced from top industry providers such as 3M, Arlon, Bergquist, Isola, Rogers, ITEQ, Taconic, Ventec and others. You can rely on Advanced Circuits, one of the largest PCB manufacturers in China, to source the materials for your next HDI PCB design. Our laminate offerings include: Ultra-Low Loss Halogen Free High Speed Digital High Thermal Reliability Lead-Free High Tg RoHS Compliant

Gerber files have become the printed circuit board manufacturing industry`s standard design file output for PCB fabrication. When your PCB design is complete and you are ready for manufacturing your circuit boards, the first thing you need to do is to export your design files in Gerber format. But, why not just save the project in your software and provide the Native file? Gerber format makes your design data unequivocal to all fabrication software and systems necessary for PCB fabrication. When exporting your design in this format, Gerber files represent copper layers, solder mask, legend, and drill and route data clearly. Below is an example of a Gerber file: Checking for Possible PCB Fabrication Issues Advanced Circuits has developed a free online tool, FreeDFM, to ensure your PCB`s Geber files are complete and free of manufacturability issues before you send your files to your PCB fabricator. After you have exported your Gerber files from your PCB design software of choice, you will want to make sure the Gerber files are compressed into a .Zip folder before uploading the files to FreeDFM. First, make sure you are familiar with the common Gerber file extensions. You will need to specify each layer to ensure the check is done correctly. Common Gerber file extensions include: pcbname.GTL – Top Copper pcbname.GTS – Top Soldermask pcbname.GTO – Top Silkscreen pcbname.GBL – Bottom Copper pcbname.GBS – Bottom Soldermask pcbname.GBO – Bottom Silkscreen pcbname.TXT – Drills pcbname.GML/GKO – Board Outline Next, FreeDFM will analyze each file to ensure that you are not missing any required files for manufacturing and will also for things that will cause issues in the manufacturing process or overall functionality such as inadequate Soldermask clearance, missing drill hits, line width and other issues. Once the tool has completed the analysis of your Gerber files, you will receive a comprehensive report of all possible manufacturability issues found within minutes in your email inbox automatically and 100%. Being able to identity these issues prior to sending the files to the manufacturer saves you time by avoiding production holds, and also saves you money by receiving the design as intended on your first run. Below are each of the items that FreeDFM checks for on each upload: Complete ZIP Files Gerber file for each copper layer Gerber file for each soldermask layer Gerber file for each silkscreen layer Excellon or Gerber drill file Inner Plane Layers Spacing Trace width Annular ring Inner clearance (drill to feature) Thermal reduction Outer Layers Spacing Trace width Annular ring Drill Double hits Missing hits Inner Signal Layers Spacing Trace width Annular ring Inner clearance (drill to feature) Soldermask Undersized clearances Missing clearances Silkscreen Line width

With the increasing proportion of China's PCB output value in the world, the PCB industry in mainland China has entered a stage of sustained and stable growth. In 2017, the output value of China's PCB industry will reach 28.08 billion US dollars. The output value of China's PCB industry will increase from 27.1 billion US dollars in 2016 to 31.16 billion US dollars in 2020, with a compound annual growth rate of 3.5%. Development Trend 1: Improvement of Production Automation and Change of Production Mode PCB industry belongs to labor-intensive industry. With the increase of labor cost, enterprises will gradually carry out industrial automation transformation, gradually changing from manual production mode to automatic equipment production mode. Development Trend 2: Policies are continuously issued, and there is a huge market development space. Electronic information is a key strategic pillar industry in China. Printed circuit boards (PCBs) are the basic products of electronic products. The vigorous development of national policies promotes and guides the benign development of the industry. Development Trend 3: Automotive Electronics Promotes Rapid Growth of PCB Demand. The application field of PCB involves almost all electronic products, and it is an indispensable basic component of modern electronic equipment. The rapid growth of automotive electronics has brought about a multiplier growth of the corresponding demand for automotive PCB. Development Trend 4: Pollutant Control, Processing, Manufacturing and Products to Environmental Protection With the prominent ecological environment problems, the concept of green environmental protection has been recognized in the electronic industry. Under the stringent environmental standards, enterprises need to establish a more perfect environmental protection system, the sustainable development of the future industry, the future industry processing and production will develop towards environmental protection. [The development of IC industry in China is turning to service-oriented services] The China–United States trade war has indeed brought about crises, but in fact more opportunities, because it has a positive impact on the industry, breaking the illusion of buying and using overseas technology. At the critical moment, supply chain security determines the fate of many companies, and domestic semiconductor companies need to shoulder this important task. The China–United States trade war has increased the domestic semiconductor industry's market share by 4%, about 100 billion yuan, which is equivalent to a large fund and can create a lot of listed companies. With the development of domestic semiconductor industry, the significance of import substitution and import substitution several years ago has changed. Wang Lin said that at that time, most domestic semiconductors belonged to the blank market. As long as the chip can be developed in any field, the performance is similar and the price is lower, there will be many fake customers to adopt it. Import substitution is easy to achieve. However, the import substitution under the Sino-US trade war requires more performance, quality and reliability, followed by cost. Five aspects determine the position of chip manufacturers in the competition. Wang Lin pointed out that research and development, supply chain is difficult to compete with foreign manufacturers PK. The era of competing talents has passed, and only the gross profit margin can be matched. The most important thing is the matching service. Chip design company is not the primary industry, but the third industry. With the advent of scientific innovation board, the industry's mentality tends to be impetuous. In this regard, Wang Lin stressed that without a decade of determination to sharpen a sword, whether it is semiconductor start-up or investment is very dangerous, and the need for a long-term determination in this field. Shenzhen will actively introduce major projects of 5G industry, and PCB and other sub-fields will benefit first. Shenzhen has issued a number of measures to take the lead in realizing full coverage of 5G infrastructure and promoting high-quality development of 5G industry. It points out that optimizing the direction of funds should focus on supporting 5G development. Give full play to the role of municipal financial special funds, and support the development of 5G industry through diversified support methods such as direct subsidies, loan discounts, risk compensation, etc. For telecom operators who have completed the target of 5G base station construction on time, in principle, they will be awarded 10,000 yuan for each base station constructed in an independent networking mode, and 150 million yuan for a single Telecom operator. Huajin Securities pointed out that the 5G investment wave in infrastructure will drive enterprises in the industrial chain to gradually cash in their performance. In the initial stage of communication network construction, the sub-fields of wireless antenna/filter RF devices, optical modules in optical connection, PCB and so on will take the lead in benefiting.

Mobilephone circuit board design to improve audio performance should: 1. Carefully consider the underlying planning. Ideal bottom-level planning should divide different types of circuits into different regions. 2. Use differential signals whenever possible. Audio devices with differential input can suppress noise. Differential signals can not be grounded in the middle. Because the most important point of the application principle of differential signals is to utilize the benefits of mutual coupling between differential signals, such as magnetic flux elimination, anti-noise ability and so on. If ground wire is added in the middle, the coupling effect will be destroyed. There are two points to be noticed in the wiring of differential pairs. One is that the length of two lines should be as long as possible, and the other is that the distance between two lines (which is determined by differential impedance) should remain constant, that is, to keep parallel. There are two parallel ways, one is to walk two lines in the same side-by-side layer, the other is to walk two lines in the upper and lower adjacent two layers (over-under). Generally, the former side-by-side is implemented in many ways. 3. Isolate grounding current to avoid digital current increasing the noise of analog circuit. Basically, it's right to isolate analog/digital partitions. Attention should be paid to signal routing as far as possible not to cross the partitioned area, and do not let the power supply and signal return current path change too much. The requirement that the digital and analog signals can not be crossed is that the return current path of the faster digital signals will flow back to the source of the digital signals as far as possible along the ground near the bottom of the line. If the digital and analog signals are crossed, the noise generated by the return current will appear in the analog circuit area. The analog circuit uses star grounding. Audio power amplifiers generally consume a large amount of current, which may have adverse effects on their own grounding or other reference grounding. Turn unused areas on the circuit board into grounding surfaces. The grounding coverage is realized near the signal line to distribute the excess high frequency energy in the signal line to the earth through capacitive coupling. Mobilephone circuit board design should not improve audio performance: 4. Use hybrid circuit on board. Although the RF area of mobile phones is generally considered analog, the noise coupled from the RF area to the audio circuit is demodulated to audible noise. 5. Analog audio signal wiring is too long. Too long analog audio tracks may be disturbed by noise from digital and radio frequency circuits. 6. Forget the importance of grounding circuit. Serious distortion, noise, crosstalk and low RF immunity will occur in systems with poor grounding. 7. The natural circuit of interrupting digital current. This path produces the smallest ring area, which can reduce the antenna and inductance effects. 8. The bypass capacitance is neglected to be placed as close as possible to the power pin of the bypass capacitor.

In today's PCB key application objects, automotive PCB occupies an important position. Due to the special working environment, safety and high current requirements of automobiles, the reliability and environmental adaptability of PCB are highly demanded, and the types of PCB technology involved are also wider. This is a challenge for PCB enterprises, and for those who want to develop the automotive PCB market, they need to know more about and analyze the new market. PCB for automobiles emphasizes high reliability and low DPPM. Does our company have the accumulation of technology and experience in high reliability manufacturing? Is it consistent with the future direction of product development? In terms of process control, can we do it well according to the requirements of TS16949? Has low DPPM been achieved? All of these should be carefully evaluated. Blind entry of this attractive cake will do harm to the enterprise itself. Following are some typical practices of some automotive PCB enterprises which specialize in the production of automotive PCB in the testing process, which can be referred to by PCB colleagues. 1. Secondary test method Some PCB manufacturers adopt the "secondary test method" to improve the rate of defect plate found by the first high voltage electrical breakdown. 2. Anti-dull Testing System for Bad Board More and more PCB manufacturers have installed "good board marking system" and "bad board error-proof box" in the light board tester to effectively avoid human leakage. The good board marking system identifies the tested PASS boards for the tester, which can effectively prevent the tested boards or bad boards from flowing into the hands of customers. In the process of testing, when the PASS board is tested, the test system outputs the signal that the box opens. On the contrary, when the bad board is tested, the box closes, so that the operator can place the tested circuit board correctly. 3. Establishing PPm Quality System At present, the quality system of PPm (Partspermillion, millionth defect rate) has been widely used in PCB manufacturers. Among many of our customers, Itachi ChemICal in Singapore is the most valuable reference for its application and achievements. In this factory, more than 20 people are specially responsible for the statistical analysis of online PCB quality abnormalities and PCB quality abnormalities returns. SPC production process statistical analysis method is used to classify each defective plate and each defective plate returned for statistical analysis, and combined with Micro-slicing and other auxiliary tools to analyze which manufacturing process produces defective and defective plate. According to the statistical data results, purposefully solve the problems in the process. 4. Comparative Testing Method Some customers use two different brands of PCB to test in different batches, and track the PPm situation of the corresponding batches, so as to understand the performance of the two kinds of testers, so as to select better performance testers to test PCB for automobiles. 5. Improving test parameters Select higher test parameters to strictly detect such PCB/PCBA OEM agent. Because, if higher voltage and threshold are chosen, the detection rate of PCB defective plate can be improved by increasing the number of high voltage leakage reading. For example, a large Taiwanese-funded PCB enterprise in Suzhou uses 300V, 30M and 20Euro to test PCB for automobiles.

Today's cellular phone design integrates everything in a variety of ways, which is detrimental to RF circuit board design. Nowadays, the competition in the industry is very fierce. Everyone is looking for ways to integrate the most functions with the smallest size and the smallest cost. Analog, digital and RF circuits are closely packed together, and the space used to separate the problem areas is very small, and the number of circuit board layers is often minimized considering cost factors. Incredibly, multipurpose chips can integrate multiple functions on a very small bare chip, and the pins connecting the outside world are arranged very closely, so RF, IF, analog and digital signals are very close, but they are usually electrically unrelated. Power distribution can be a nightmare for designers. In order to prolong battery life, different parts of the circuit work on a time-sharing basis and are controlled by software. This means that you may need to provide five or six power sources for your cellular phone. In designing RF layouts, there are several general principles that must be addressed first: Separate the high power RF amplifier (HPA) from the low noise amplifier (LNA) as far as possible. In short, keep the high power RF transmitting circuit away from the low power RF receiving circuit. If you have a lot of physical space on your PCB board, you can easily do this, but usually there are many components, and PCB space is small, so this is usually impossible. You can put them on both sides of the PCB board or have them work alternately instead of simultaneously. High power circuits sometimes include RF buffers and voltage controlled oscillators (VCO). Make sure that there is at least one whole area in the high power area of the PCB board, preferably no holes in it. Of course, the more copper, the better. Later, we will discuss how to break this design principle as needed and how to avoid the problems that may arise from it. Chip and power decoupling are equally important, and several ways to implement this principle will be discussed later. RF output usually needs to be away from RF input, which we will discuss in detail later. Sensitive analog signals should be as far away from high-speed digital signals and RF signals as possible. How to partition? Design partitions can be decomposed into physical and electrical partitions. Physical zoning mainly involves the layout, orientation and shielding of components; electrical zoning can continue to be decomposed into power distribution, RF routing, sensitive circuits and signals, as well as grounding zoning. First, we discuss physical partitioning. Component layout is the key to achieve an excellent RF design. The most effective technology is to fix the components on the RF path and adjust their orientation to minimize the length of the RF path, keep the input away from the output, and separate the high-power and low-power circuits as far as possible. The most effective way to stack circuit boards is to arrange the main ground surface (main ground) on the second layer below the surface, and to move the RF line on the surface as far as possible. Minimizing the size of the through hole in the RF path not only reduces the path inductance, but also reduces the virtual solder joints on the main floor, and reduces the chances of RF energy leakage to other areas in the laminate. In physical space, linear circuits such as multistage amplifiers are usually sufficient to isolate multiple RF regions from each other, but duplexers, mixers and IF amplifiers/mixers always have multiple RF/IF signals interfering with each other, so this effect must be carefully minimized. RF and IF routes should be crossed as far as possible, and as far as possible separated from each other. The correct RF path is very important for the performance of the whole PCB board, which is why the component layout usually takes up most of the time in the PCB board design of cellular phone. In cellular telephone PCB board, low noise amplifier circuit can be placed on one side of PCB board, while high power amplifier circuit can be placed on the other side, and eventually connected to the antenna of RF and baseband processor on the same side through duplexer. Some techniques are needed to ensure that the RF energy is not transferred from one side of the board to the other through the hole. The common technique is to use blind holes on both sides. By arranging the straight through hole in the area of the PCB board which is not disturbed by RF, the adverse effect of the straight through hole can be minimized. Sometimes it is impossible to ensure adequate isolation between multiple circuit blocks. In this case, it is necessary to consider the use of metal shield to shield RF energy in the RF area. However, there are also problems with metal shield, such as: both its own cost and assembly cost are very expensive; Metal shield with irregular shape is difficult to ensure high precision in manufacturing, and the layout of components is limited by rectangular or square metal shield. Metal shield is not conducive to component replacement and fault location. Because metal shield must be welded to the ground, it must keep a proper distance from components, so it is necessary. Take up valuable PCB board space. It is very important to ensure the integrity of the shield as far as possible. The digital signal line entering the metal shield should go as far as possible to the inner layer, and the PCB layer below the wire layer is the best layer. RF signal lines can go out of the wiring layers at the small notches at the bottom of the metal shield cover and the ground notches, but the areas around the notches should be as many as possible, and the ground on different layers can be connected through multiple holes. Despite these problems, metal shielding is very effective and often the only solution to isolate critical circuits. In addition, proper and effective decoupling of chip power supply is also very important. Many RF chips integrated with linear circuits are very sensitive to power supply noise. Usually each chip needs up to four capacitors and one isolation inductor to ensure that all power supply noise is filtered out. The minimum capacitance usually depends on its self-resonant frequency and low-pin inductance, and the value of C4 is chosen accordingly. The values of C3 and C2 are relatively larger due to the relationship between their pin inductances, so the RF decoupling effect is worse, but they are more suitable for filtering low frequency noise signals. Inductance L1 prevents RF signals from being coupled from power lines to chips. Keep in mind that all routes are potential antennas that can receive and transmit RF signals, and it is also necessary to isolate the induced RF signals from the key lines. The physical location of these decoupling elements is usually also critical. The layout principles of these important elements are as follows: C4 must be as close to IC pin as possible and grounded, C3 must be nearest to C4, C2 must be nearest to C3, and the connection between IC pin and C4 should be as short as possible. The grounding end of these elements (especially C4) should usually pass through the next place. The layer is connected to the ground pin of the chip. The holes connecting the elements to the formation should be as close as possible to the component pad on the PCB board. It is better to use blind holes on the pad to minimize the inductance of the connection line and the inductance should be close to C1. An integrated circuit or amplifier often has an open-drain output, so a pull-up inductor is needed to provide a high impedance RF load and a low impedance DC power supply. The same principle applies to decoupling the power supply at the inductor end. Some chips require multiple power supplies to work, so you may need two or three sets of capacitors and inductors to decouple them separately. If there is not enough space around the chip, you may encounter some problems. Keep in mind that inductances are rarely parallel because they form a hollow transformer and interact with each other to produce interference signals, so the distance between them should be at least equal to the height of one of the devices, or arranged at right angles to minimize their mutual inductance. The principle of electrical zoning is basically the same as that of physical zoning, but it also contains some other factors. Some parts of modern cellular phones use different operating voltages and are controlled by software to prolong battery life. This means that cellular phones need to run multiple power sources, which brings more problems to isolation. The power supply is usually introduced from the connector and decoupled immediately to remove any noise from the outside of the circuit board, which is then allocated after a set of switches or regulators. The DC current of most circuits in cellular telephones is quite small, so the wiring width is usually not a problem. However, a large current line as wide as possible must be separately used for the power supply of high power amplifiers to minimize the transmission voltage. In order to avoid too much current loss, it is necessary to use multiple through holes to transfer current from one layer to another. In addition, if it can not be decoupled adequately at the pin end of the high power amplifier, the high power noise will radiate to the whole board and bring various problems. Grounding of high power amplifier is very important, and it is often necessary to design a metal shield for it.

Flying needle test is a method to check the electrical function of PCB, and it is an important part of PCB process. Flying needle test is very popular in PCB manufacturing because it does not require fixtures, can reduce production costs, and the operation is very simple and fast. It can be said that almost every PCB factory is using flying needle test. A series of flying needle testers with high test density, flexible test speed and low false alarm rate, developed and manufactured by Nanjing Xiechen, are widely used in PCB industry and are well recognized and supported by PCB manufacturers. For many years in the field of PCB testing, Xiechen has made numerous explorations and attempts in the field of flying needle testing, and has also achieved a lot of technical results. In this article, we will sort out the technical achievements of flying needle test in Nanjing Xiechen, present and introduce the accumulated technological achievements of Xiechen over the years, so that more PCB manufacturers can understand the advantages and potential of Xiechen flying needle test, and find the flying needle test equipment and technology suitable for their PCB production. Intelligent Electrical Measuring Equipment V10 V10 is a recently launched heavy product, which can create a highly competitive intelligent electrical measurement workshop for PCB factories. Advantages: 1. PCB under 30 square meters can realize the full flying needle test efficiently and reliably. 2. Automated data output without data processing personnel; 3. Collaborate ECS electric measurement workshop management system to realize real-time status, time crop mobility, performance crop mobility and quality crop mobility management, and produce traceable reports: job production reports, machine production reports, material number production reports. 4. AGV can be docked to realize unattended handling and automatic loading and unloading. V8 Series of Ultra-high Speed Flying Needle Tester V8 series flying needle tester can be compatible with all types of PCB. It uses well-known screw rod and guide rail to ensure the test accuracy to the greatest extent. At the same time, the mechanical speed can be increased by more than 30% and the ultra-high test speed can be achieved. Advantages: 1. In order to save raw materials and improve production efficiency, more customers choose 43*49 inch bulk material. The testing area of PNL will reach 21.5*24.5 inch (546*620 mm), while the maximum testing size of V8 series will reach 710 mm*610 mm. 2. Pre-forming test (large PNL test) has been recognized by more and more companies. However, due to the large area of the whole board, slight shaking will inevitably occur during the test process. V8 series flying needle tester has added side fixture, which can effectively ensure the stability of the side. 3. A clamp is added to the upper plate position to operate the panel. The upper and lower plates can quickly control the opening and closing of the clamp as long as they are pressed lightly. Here, not only make the upper and lower boards more convenient, but also greatly reduce the movement of employees'limbs and reduce the intensity of their work. FPC/IC Carrier Plate Tool X500 Series X500 series is FPC, IC board detection sharp instrument. Advantages: 1. The test accuracy of X400H can reach 20 micron, which can meet the current domestic high-precision FPC and IC board test accuracy requirements. 2. Using a new CCD module, the resolution of the alignment image is increased three times, which ensures the alignment accuracy, and at the same time, the condition of the designed circuit can be observed more clearly. 3. Strong vacuum suction table greatly reduces the influence of plate warping on test. Ultra-large size flying needle test Large-size backplane is a kind of high-end PCB product which has developed rapidly in recent years. It generally has the characteristics of large size and many layers. Because of the large size, the test size of the general flying needle tester can not meet the requirements at all. The flying needle tester X900 & X1200, launched by Xiechen, is equipped with super-large test bench, which can effectively test this kind of PCB. Advantages: 1. Super-large test table with maximum test size up to 1200X700mm. 2. The preferred testing equipment for communication backplane is to reduce the risk of missing detection in network partitioning test. V6 series V6 series flying needle tester can be compatible with any type of PCB and complete the test at high speed. Advantages: The average speed of O/S test increased by more than 30%. The average test efficiency of low resistance and pure resistance increases by more than 50%. Technical Advantage of Xiechen Flying Needle 1. Each test needle has a closed-loop pressure control system, which ensures that the test of different plate thickness can guarantee very good needle mark control without any debugging. At the same time, with different test needles, needle marks can be controlled for any type of test. 2. Four groups of test needles, four CCDs, are fixed on the same module, which ensures the consistency of the position between the CCD and the test needle. At the same time, four groups of CCDs can automatically compensate the rotation of the splint to ensure more accurate alignment. 3. Four groups of CCDs can set CCD real-time viewing when testing problems, which is convenient for viewing the actual situation of PAD on the test board, and can move the test needle in real time to ensure the accuracy of testing. Identify problems and deal with them in time to ensure the efficiency of output. 4. The software has V-CUT test point test function, which can test any required V-CUT test point. 5. In the actual production of PCB, because of the overlapping errors of each process, the PCB will inevitably have a deflection of expansion and contraction board. When the electric measuring process passes through the special or general testing machine, there will be a certain percentage of boards with false OPEN points (these boards can hardly be measured again). The data of fake OPEN point plate measured by the customer's general purpose machine are linked to the flying needle machine with the easy-to-connect software to retest only for the fake OPEN point, and the tail plate is processed quickly. 6. Four-terminal test can detect the voids and thin copper in PCB, the bad conductivity of HDI plate caused by residual glue after laser drilling, and so on. It is accurate to mΩ. 7. Edge Running Function: In order to prevent the needle from breaking directly into the hole, the function of automatically moving the measuring point to the hole ring can prevent the abnormal occurrence of the broken needle and ensure the output efficiency. 8. To match different surface and function tests, four common test needles are used: ordinary needle for normal test, dense plate needle, low resistance four-thread needle, and micro-needle for plate with very strict requirements for needle printing. There are many choices to ensure the test quality according to different requirements of the board. 9. Strong data compatibility, compatible with a variety of formats, convenient for customers to work uniformly in the factory, save the cost of purchasing new software.

The lack of a unified communication format for PCB production and equipment has always been the bottleneck for industry wisdom. The Taiwan PCB Association (TPCA) established SECS/GEM as the basis of communication in the semiconductor industry in 2015. After six expert meetings, it was simplified to PCBECI that meets the needs of the industry as a two-way communication format between the PCB board fabrication factory and the equipment. In 2016, an Automation Committee was established under the International Semiconductor Association (SEMI) to make efforts to internationalize PCBECI. After three standard proposals and technical replies, it finally passed the global technical vote in 2018 and became the official standard document of SEMI in September this year. TPCA said at the PCBECI Device Networking Demonstration Team Launching Conference earlier this year that 85% of PCB operators are in the state of stand-alone automation. Among them, most of the equipment production means of large-scale plate mills have been connected to the Internet, but the stations are still isolated from each other. Small and medium-sized plate mills are willing to invest in smart manufacturing, but do not know where to start, or fear that the cost is too high to step back. Therefore, TPCA hopes to help Taiwan's PCB industry enter into smart manufacturing more easily through the initiation of PCB-ECI equipment communication agreement. It is understood that in the past, PCB production was based on manual scheduling and line change. It is difficult to analyze the abnormal situation and to ensure the correctness of the problem detection. On the equipment side, the abnormal machine can not be found in the first time, only when the product is detected can we know the problem, which leads to long downtime, and consequently causes cost waste and production capacity decline. In addition, PCB manufacturing process is complex and equipment networking specifications are different, the data of each station and machine can not be integrated, and the data analysis of single point equipment can not show its value. After the introduction of networked production equipment, the future means of production can be recorded and monitored in real time, pay attention to production status and automatic line change reminder at any time, and diagnose and warn in advance for abnormal equipment, so as to prepare materials well in advance, so as to ensure high crop productivity. Liang Maosheng, deputy chairman of TPCA and chairman of Zhisheng Industry, has appealed in the past that the upgrade of Intelligent Manufacturing in mainland China should be carried out overwhelmingly. Especially, their factories are open-ended. They watch and communicate with each other among their peers, and their growth rate is rapid. It is hoped that with the promotion of standardization of PCB-ECI communication agreement, Taiwan's PCB industry will accelerate the upgrading of smart manufacturing. It will also be able to advance the armed and preemptive business opportunities for the upcoming 5G field. TPCA also expressed the hope that through this standardized communication framework, the cost of communication between board mills and equipment manufacturers would be reduced, and the semiconductor industry would be the teacher to accelerate the development of Intelligent Manufacturing in the industry.